| 摘要 |
A method of manufacturing a wiring substrate of the present invention includes the steps of, preparing a laminated body having such a structure that a peelable metal foil in which a lower metal foil and an upper metal foil are laminated peelably and an opening portion is provided on a peripheral side is pasted onto a supporting body, forming a through hole having a diameter smaller than the opening portion by processing a portion of the supporting body on an inner side of the opening portion to obtain a reference hole having a projection portion in an inside, forming a resin layer on the peelable metal foil and the projection portion in the reference hole to cover a side surface of the opening portion, and then forming a build-up wiring on the resin layer, removing portions of the build-up wiring and the laminated body corresponding to an area containing the opening portion to expose a peeling boundary of the peelable metal foil, peeling the upper metal foil from the lower metal foil at a boundary to separate the upper metal foil and the build-up wiring from the supporting body side, and removing the upper metal foil from the build-up wiring.
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