| 摘要 |
<p>A conveyor for a semiconductor bonding is provided to improve the process efficiency of a bonding process by adjusting a transfer path width according to a width of a lead frame. A conveyor(100) for a semiconductor bonding includes a fixed rail(10), a movable rail(20), a variable unit(30), and a heater block(40). The movable rail is apart from the fixed rail by a distance. A transfer path for materials is formed on the movable rail. The variable unit changes the movable rail, such that a width of the transfer path is adjusted according to a width of the materials. The heater block is fixed on the movable rail. When the variation unit changes the movable rail, such that the width of the transfer path is adjusted, the heater block heats up the material in the transfer path.</p> |
