| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting element capable of improving its heat radiation property. <P>SOLUTION: The semiconductor light emitting element has a first lead, a second lead, a semiconductor light emitting element chip which is die-bonded onto the first lead and is wire-bonded to the second lead, and a metal body for heat radiating which is fastened to the first and second leads via an insulating adhesive layer. <P>COPYRIGHT: (C)2007,JPO&INPIT |
