APPARATUS AND METHOD FOR BAKE

摘要

A bake method is provided to prevent the temperature of the surface of a wafer from being nonuniform by the peripheral temperature of the wafer by rotating the wafer while the water is heated. The upper surface of a support plate installed in a housing is loaded with a wafer by using a transfer apparatus(S10). The loaded wafer is transferred downward along the slope of a guide member so as to be guided to a predetermined position by the guide member. The wafer is rotated by a driving unit while the wafer is heated by a heating unit(S20).