| 摘要 |
A method of processing a solder resist is provided to improve an operation reliability of an electronic component by reliably mounting the electronic component on a PCB. A screen mask is provided on a land region which includes plural lands(11) on a PCB(Printed Circuit Board). A solder resist(22) is applied on a region except for the screen mask. The solder resist is cured. The screen mask is removed. In the land region, a stud of a flip chip is flip-bonded with a land of the PCB. The solder resist is applied by using a squeeze scheme. After the screen mask is removed, the flip-chip is flip-bonded with the land region.
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