| 摘要 |
A method for manufacturing a wafer level package is provided to economize manufacturing costs and to reduce a processing time by forming an external connection terminal without the formation of a metal base layer using a gold bump with an acute end portion capable of attaching stably solders to the gold bump itself. A wafer with a circuit pattern and a chip pad(15) is prepared. A gold bump(20) is formed on the chip pad. A solder(60) is melted by applying the heat to a mold frame. The wafer approaches the mold frame, so that the gold bump is penetrated into the solder. The gold bump has an acute end portion. An Au stud bump is used as the gold bump.
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