<p>Provided is a method for preparing a circuit assembly. The method includes (a) applying a curable coating composition to a substrate, the curable coating composition formed from (i) one or more active hydrogen-containing resins, (ii) one or more polyester curing agents, and (iii) optionally, one or more transesterification catalyts; (b) curing the curable coating composition to form a coating on the substrate ; and (c) applying a conductive layer to the surface of at least part of said cured composition. A circuit assembly prepared by the method also is provided.</p>
申请公布号
MX2007007168(A)
申请公布日期
2007.08.14
申请号
MX20070007168
申请日期
2005.12.16
申请人
PPG INDUSTRIES OHIO, INC.
发明人
OLSON, KEVIN, C.;MCCOLLUM, GREGORY J.;MORIARITY, THOMAS, C.;SANDALA, MICHAEL, G.