LASER REPAIR SYSTEM CAPABLE OF FUSING RESIDUE IN LASER REPAIR PROCESS

摘要

A laser repair system capable of removing residual fuse is provided to control a short-circuit defect of a semiconductor chip by preventing formation of a bridge caused by fusing residue. A focus lens(102) is mounted on laser repair equipment. A focus lens driving motor(104) is positioned on the focus lens. A laser generation source(106) irradiates laser to a wafer(114) through the focus lens. A wafer mounting table(108) is installed under the focus lens, separated from the focus lens. A gas injection kit(110) removes the fusing residue on the wafer having undergone a fusing process by using high pressure gas, installed along the outer part of the focus lens. Non-flammable gas can be used in the gas injection kit, selected from air, nitrogen, argon or carbon dioxide.