发明名称 METHODS FOR FORMING SEMICONDUCTOR DEVICES HAVING SILICIDED GATE ELECTRODES
摘要 <p>A semiconductor device having a silicide layer on a gate electrode is provided to improve a breakdown voltage by forming a silicide layer on a gate electrode of a memory cell wherein the silicide layer is not formed on a source/drain region. A non-volatile memory device(50) is formed on a substrate(10). A transistor(70) for a peripheral circuit is formed on the substrate. A silicide layer is formed on the control gate(54) of the non-volatile memory device and on the gate of the transistor. An interlayer dielectric whose upper surface is substantially flat is formed on the non-volatile memory device and the transistor, having an opening exposing the silicide layer. The upper surface of the control gate and the upper surface of the gate can be completely covered with the silicide layer.</p>
申请公布号 KR20070080514(A) 申请公布日期 2007.08.10
申请号 KR20060011878 申请日期 2006.02.07
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 RYU, JI DO;CHOI, SUNG GON;JEON, HEE SEOG;YOO, HYUN KHE
分类号 H01L29/78;H01L21/24 主分类号 H01L29/78
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