| 摘要 |
A transfer apparatus of a semiconductor wafer is provided to improve the adhesiveness of a pad by increasing a bonding area between the pad and a vacuum groove using a bonding groove with a lattice type convexo-concave structure. A transfer apparatus of a semiconductor wafer includes a driving unit(100), a robot arm(200) controlled by the driving unit, an arm blade, and a pad. The arm blade(300) is connected to the robot arm. The arm blade includes an adsorbing portion(310) with a vacuum groove(312). The pad(330) is inserted into the vacuum groove in order to support the wafer. The pad reduces the thermal shock due to the deviation of temperature between the arm blade and the wafer. The arm blade includes a predetermined groove. The predetermined groove is connected with the vacuum groove through a sidewall of the vacuum groove in order to be connected through the external air of the adsorbing portion.
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