| 发明名称 |
POLISHING COMPOSITION AND METHOD FOR DEFECT IMPROVEMENT BY REDUCED PARTICLE STICTION ON COPPER SURFACE |
| 摘要 |
A chemical-mechanical polishing composition comprising abrasive particles, a hydroxyquinoline, and a diamine compound comprising an ether group, and a method of chemically-mechanically polishing a substrate with the aforementioned polishing composition. |
| 申请公布号 |
WO2006132905(A3) |
申请公布日期 |
2007.08.09 |
| 申请号 |
WO2006US21244 |
申请日期 |
2006.06.02 |
| 申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
WANG, YUCHUM;SUN, FRED F.;HAWKINS, JOSEPH D. |
| 分类号 |
C09G1/02;H01L21/321 |
主分类号 |
C09G1/02 |
| 代理机构 |
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代理人 |
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