| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device and a substrate treatment method capable of enhancing measuring precision by simple structure and a simple method. SOLUTION: This substrate treatment method used in place of a conventional substrate treatment method for treating a substrate includes a vapor decomposition tool preparing process for preparing a vapor decomposition tool having an opening part opposed to a face of the substrate and an inner space communicated with the opening part, the first vapor guide process for guiding the first vapor, that is the vapor of the first liquid capable of dissolving an oxide film of the substrate, to the inner space, and the second vapor guide process for guiding the second vapor, that is the vapor of the second liquid capable of dissolving a base material of the substrate, to the substrate. COPYRIGHT: (C)2007,JPO&INPIT
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