| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of forming a precise conductor wiring pattern. SOLUTION: The epoxy resin composition contains a polymer (A1) with a weight average molecular weight of 5,000-100,000 having a functional group (x) capable of reacting with an active hydrogen containing functional group, and a binder polymer (A) produced by a reaction of a resin (A2) having an active hydrogen containing functional group (y) or a polymer (B1) with weight average molecular weight of 5,000-100,000 having the active hydrogen containing functional group (y), and a binder polymer (B) produced by a reaction of a resin (B2) having a functional group (x) capable of reaction with an active hydrogen containing functional group, an epoxy resin (C), and a curing agent (D) wherein the difference (ΔSP<SB>C</SB>) between SP values of the epoxy resin (C) and the resin (A2) or the resin (B2) or the difference (ΔSP<SB>D</SB>) between SP values of the curing agent (D) and the resin (A2) or the resin (B2) is 2.0 (cal/cm<SP>3</SP>)<SP>1/2</SP>or less. COPYRIGHT: (C)2007,JPO&INPIT |
