发明名称 |
Printed circuit board including reinforced copper plated film and method of fabricating the same |
摘要 |
A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
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申请公布号 |
US2007181993(A1) |
申请公布日期 |
2007.08.09 |
申请号 |
US20070699498 |
申请日期 |
2007.01.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
CHOI JAE-HOON;YU KWANG-SU;BANG HYO-JAE;LEE DONG-CHUN |
分类号 |
H01L23/04 |
主分类号 |
H01L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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