发明名称 Printed circuit board including reinforced copper plated film and method of fabricating the same
摘要 A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
申请公布号 US2007181993(A1) 申请公布日期 2007.08.09
申请号 US20070699498 申请日期 2007.01.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI JAE-HOON;YU KWANG-SU;BANG HYO-JAE;LEE DONG-CHUN
分类号 H01L23/04 主分类号 H01L23/04
代理机构 代理人
主权项
地址