| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for evaluating a piezoelectric element for accurate evaluation of close adhesion of a layer forming the piezoelectric element. <P>SOLUTION: This evaluation method is capable of executing evaluation of the degree of close adhesion of the layer constituting a piezoelectric element formed under each film forming condition. The method sequentially conducts until an order of superiority of determination result may be attained for a testing piece under each film forming condition, a first determining step of measuring peeling strength of each testing piece with the m-ELT method to determine a rate in the number of testing pieces having generated peeling at the time of measurement, by manufacturing, under different film forming conditions, a plurality of the testing pieces including at least a lower electrode film to constitute a piezoelectric element on the predetermined substrate; a second determining step of determining peeling interface of the testing piece having generated the peeling; a third determining step of determining a peeling are; and a fourth determining step of determining peeling strength. <P>COPYRIGHT: (C)2007,JPO&INPIT |
