MANUFACTURING METHOD FOR COMPOSITE SUBSTRATE WITH IMPROVED ELECTRICAL CHARACTERISTICS

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a composite substrate which has at least one thin insulating layer attached between a support substrate and an active layer of a semiconductor material.

SOLUTION: The manufacturing method includes steps of: forming or depositing an insulating layer 32 on a source substrate, and in some cases forming or depositing an insulating layer 31 on the support substrate 1; heat recovery treating the insulating layer 32, and in some cases the insulating layer 31 formed on the support substrate 1; plasma activating at least one of two planes to be bonded; bonding two substrates using the molecule bonding such that the insulating layer 32 is located between the support substrate 1 and source substrate; and eliminating a part of the source substrate to retain only a thickness of a material composing the active layer 21. The method manufactures a substrate 4 with improved electrical characteristics.

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