| 摘要 |
PROBLEM TO BE SOLVED: To miniaturize a ball grid array applicable even when a single semiconductor chip is mounted on an interposer by decreasing the number of ball terminals for connecting the ball grid array. SOLUTION: At least one solder ball 5 used as a power supply terminal or a GND terminal in an interposer 1 is connected, as a common solder ball, with at least two pads 20 used as a power supply pad or a GND pad in a semiconductor chip 2. Since the number of the solder balls 5 can be decreased as compared with the number of pads 20 of the semiconductor chip 2, a ball grid array 10 can be miniaturized. COPYRIGHT: (C)2007,JPO&INPIT |
