| 摘要 |
PROBLEM TO BE SOLVED: To provide a device giving a thick film pattern of high precision and a high aspect ratio at high productivity. SOLUTION: The film peeling device for use in the forming method of the thick film pattern includes the steps of forming a thick film 2 comprising resin and inorganic powder on a substrate 1, forming a resist pattern 3 on the surface of the thick film, peeling and removing the thick film in the shape of a pattern by giving peeling liquid 5 for resolving or swelling the resin of the thick film to a region where a resist film does not exist, and burning a formed thick film pattern. The device comprises the carrier device of the patternized substrate, a tank having the peeling liquid 5 for peeling the resin layer formed on the substrate in the shape of a pattern, and an injector for injecting the peeling liquid 5 and a substrate support provided above the injector. The film peeling device is characterized in that at least the top portion of the substrate support is constituted by a flexible material. COPYRIGHT: (C)2007,JPO&INPIT |
