| 摘要 |
PROBLEM TO BE SOLVED: To prevent contamination due to dust and lead terminals from being bent, when housed by testing semiconductor devices, as it is, in a tray with a lid for semiconductor devices. SOLUTION: Semiconductor devices 1 are housed in housing parts on a tray base 2 and covered with a tray lid 3. The tray lid 3, located immediately above lead terminals 1 of the semiconductor devices 1, is provided with contact-pin through holes 4 through which IC-tester contact pins 11, capable of elevation and lowering are inserted. Pin holding parts 12 for holing contact pins are fitted in the contact-pin through holes 4 to position the tray lid 3 to the contact pins 11. Since it is possible to make the contact pins 11 contact the lead terminals 1a and execute test only by opening the small-diameter contact-pin through holes 4 in the tray lid 3, contamination of the semiconductor devices 1 and bending of leads, when housed are suppressed. COPYRIGHT: (C)2007,JPO&INPIT
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