| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper clad plate suitable as a material of a flexible printed wiring board enabling the formation of fine wiring, not deformed even if lead-free solder is used and excellent in dimensional stability and heat resistance. SOLUTION: A polyimide film, which is formed of paraphenylenediamine and 4,4'-diaminodiphenyl ether as diamine components and pyromellitic dianhydride as an acid anhydrite component and a 3,3', 4,4'-biphenyltetracarboxylic dianhidride, is used and a copper plate is provided to one side or both sides of the polyimide film using an adhesive or without using the adhesive to obtain the copper clad plate. COPYRIGHT: (C)2007,JPO&INPIT |
