发明名称 Cooling device for electronic device, has hinge or joint provided between heat guiding section and heat diffusion section, where relative angle between sections is adjusted such that hinge is utilized as rotational axis
摘要 <p>The device has a heat guiding section (11) for discharging heat produced in an electronic device. A heat diffusion section (12) is provided for receiving and further discharging of heat from the heat guiding section. A hinge (13) or joint is provided between the heat guiding section and the heat diffusion section, where a relative angle between the heat diffusion section and the heat guiding section is adjusted such that the hinge is utilized as a rotational axis.</p>
申请公布号 DE202007008128(U1) 申请公布日期 2007.08.09
申请号 DE20072008128U 申请日期 2007.06.06
申请人 TOPOWER COMPUTER INDUSTRIAL CO. LTD. 发明人
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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