发明名称 |
Printed wiring board and method of manufacturing the same |
摘要 |
<p>A printed wiring board (501) comprising two or more insulating layers (516,518) on an innerlayer conductor circuit (562), a via-hole (502) extending from an outermost surface of the insulating layer (516) through the two or more insulating layers (516,518) to the innerlayer conductor circuit (562) and an inner metal plated film (521) formed in the via-hole (502) so as to electrically connect to the innerlayer conductor circuit (562) to an outer conductor circuit (561) arranged on the outermost surface, characterized in that an annular dummy land (504) for reinforcement having an opening hole (540) around the via-hole (502) is arranged in a boundary portion (517) facing the two or more insulating layers (516,518) to each other and is joined to the inner metal plated film (521).</p> |
申请公布号 |
EP1816905(A2) |
申请公布日期 |
2007.08.08 |
申请号 |
EP20070075316 |
申请日期 |
1998.01.23 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
TAKADA, MASARU;TSUKADA, KIYOTAKA;KOBAYASHI, HIROYUKI;MINOURA, HISASHI;UKAI, YOSHIKAZU;KONDO, MITSUHIRO |
分类号 |
B23K26/00;H05K3/46;H01L21/48;H05K1/02;H05K1/03;H05K1/11;H05K1/18;H05K3/00;H05K3/34;H05K3/38;H05K3/40;H05K3/42 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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