| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a low-profile heat pipe that is mounted within a very low-profile housing and can be used for efficiently cooling heat generating electronic components, such as CPUs or the like. <P>SOLUTION: The low-heat pipe is provided, equipped with a hermetically sealed container formed by joining peripheries of foil-like lapped sheets, meshes that is stored movably in the container and is formed of vertical and horizontal wires that are different in diameters, in order to enhance capillary attraction in a predetermined direction, and a working fluid sealed within the container. <P>COPYRIGHT: (C)2004,JPO |
