发明名称 |
LASER MACHINING APPARATUS, AND APPARATUS AND METHOD FOR MANUFACTURING A MULTILAYERED PRINTED WIRING BOARD |
摘要 |
<p>A multilayer printed wiring board manufacturing apparatus comprising a CO2 laser source (60), a scanning head (70) for deflecting the direction of laser beam in the X-Y table (80) for displacing the position of the multilayer printed wiring board, wherein the laser beam oscillated from said CO2 laser source is converted to the beam of shortened wavelength by harmonic wave generating means (94).</p> |
申请公布号 |
EP0884128(B1) |
申请公布日期 |
2007.08.08 |
申请号 |
EP19970912474 |
申请日期 |
1997.11.14 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
HIRAMATSU, YASUJI |
分类号 |
B23K26/00;B23K26/02;B23K26/04;B23K26/06;B23K26/067;B23K26/08;B23K26/38;H05K1/02;H05K3/00;H05K3/46 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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