发明名称 METHOD OF TREATING A SUBSTRATE IN A SINGLE WAFER TYPE
摘要 A substrate processing apparatus and method is provided to increase the reuse ratio of a process solution by enhancing the efficiency in a process solution collecting process using an auxiliary collecting part with a collecting plate. A substrate processing apparatus includes a housing(110) having an upper opening portion, a plurality of collecting units, a spin chuck and a process fluid supply member. The plurality of collecting units are installed like an annular type structure along an inner surface of the housing. The collecting units are stacked with each other. The spin chuck(120) is used for loading and rotating a substrate. The spin chuck is capable of moving the collecting units up and down. The process fluid supply member is used for supplying a process solution onto a treatment object surface of the substrate. The lowermost collecting unit includes an auxiliary collecting part(220) with a collecting plate. The collecting part is capable of being prolonged from a lower end portion of an inlet of the lowermost collecting unit toward a lower region of the spin chuck when the spin chuck becomes located at the height corresponding to the lowermost collecting unit.
申请公布号 KR100749549(B1) 申请公布日期 2007.08.08
申请号 KR20060080587 申请日期 2006.08.24
申请人 SEMES CO., LTD. 发明人 LEE, TAEK YOUB;OH, RAE TAEK
分类号 H01L21/304 主分类号 H01L21/304
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