发明名称 |
CSP semiconductor device having signal and radiation bump groups |
摘要 |
A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a conductive film which is formed on the insulating film and the pad, a sealing material which covers a part of the conductive film and the insulating film and a bump which is formed over the conductive film, wherein the bump is exposed from a surface of the sealing material.
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申请公布号 |
US7253520(B2) |
申请公布日期 |
2007.08.07 |
申请号 |
US20040940783 |
申请日期 |
2004.09.15 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
YOSHIDA HIDEAKI;YAMANE TAE |
分类号 |
H01L23/48;H01L23/52;H01L21/3205;H01L23/12;H01L23/34;H01L23/367;H01L23/485;H01L29/06 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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