METHOD FOR TESTING DEFECT PLATING OF THROUGH-HOLE USING PULSE OF HIGH CURRENT PULSE

摘要

A method for testing defective plating of a through-hole using a high current pulse application method is provided to detect a defective through-hole plating part of PCB by applying high current pulse corresponding to thickness or pattern width of the through-hole plating part. A method for testing defective plating of a through-hole using a high current pulse application method comprises the steps of contacting a probe pin with a land including a through-hole or a through-hole plating part of PCB, and measuring a first resistance value of the through-hole plating part of the PCB(S100), applying high current pulse to the through-hole plating part of the PCB through the probe pin(S102), measuring a second resistance value of the through-hole plating part of the PCB through the probe pin after applying the high current pulse(S104), and judging defect of the through-hole plating part of the PCB by comparing the first resistance value with the second resistance value(S106-S108).