| 发明名称 |
SOLDER MATERIAL, ITS PRODUCTION METHOD AND JOINED STRUCTURE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To stably feed a lead-free solder material which can be soldered in a high temperature range. <P>SOLUTION: The solder material comprises a first eutectic alloy and a second eutectic alloy. The first eutectic alloy is composed of a Zn-Al alloy, and the second eutectic alloy is composed of at least one kind selected from the group consisting of a Ge-Ni alloy, a Cu-Ge alloy, an Ag-Cu alloy and an Ag-Ge alloy. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007190562(A) |
申请公布日期 |
2007.08.02 |
| 申请号 |
JP20060008550 |
申请日期 |
2006.01.17 |
| 申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
SUETSUGU KENICHIRO;FURUSAWA AKIO |
| 分类号 |
B23K35/28;B23K1/00;B23K101/40;C22C18/04;H01L21/52;H05K3/34 |
主分类号 |
B23K35/28 |
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