发明名称 InP-BASED SEMICONDUCTOR DEVICE USING GaAs SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To enable to form an InP-based semiconductor element which is inherently lattice matched to an InP substrate on a GaAs substrate. SOLUTION: By forming an InP metamorphic buffer layer 2 having a thickness of 4μm or above and a surface defect density of 10<SP>8</SP>/cm<SP>2</SP>or less on the GaAs substrate 1, the InP-based semiconductor element 11 having a superior property and a high reliability can be formed on the GaAs substrate. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007194363(A) 申请公布日期 2007.08.02
申请号 JP20060010194 申请日期 2006.01.18
申请人 SONY CORP 发明人 TANIGUCHI OSAMU;SUZUKI NOBUHIRO;ONO HIDEKI;YANAGIDA MASASHI
分类号 H01L21/331;H01L29/205;H01L29/737 主分类号 H01L21/331
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