| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor pressure sensor having an inexpensive mounting cost, diversifying mounting patterns, and improving reliability. SOLUTION: Metallic pins 2 are pressed in an outer case 1, a semiconductor sensor chip 3 provided in the opening in the outer case and the top end face of the metallic pin 2 are conducted by a bonding wire 4, and then a protection member is filled in the opening. The seat at the low end of the metallic pin 2 is exposed to the side and the bottom. In addition, an adhesive is filled in a recess 5a surrounded by the outer case 1 and the inside of the low end of the metallic pin (terminal) 2 (Fig. 2), and thereby adhesive strength of the outer case 1 and the metallic pin 2 is improved. COPYRIGHT: (C)2007,JPO&INPIT
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