RESIN FILM, ADHESIVE SHEET, WIRING SUBSTRATES, AND ELECTRONIC DEVICES

摘要

The invention relates to a resin film exhibiting high close adhesion to other members; an adhesive sheet improved in the close adhesion between the adhesive layer and the resin film; wiring substrates; and electronic devices. A resin film (1) which is made from a material comprising a filler (9) and a resin material and which has projections (10) containing the filler (9) at the apexes (10a), wherein the projections (10) are present on at least one side of the sheet part (16) of the film (1).