POLYIMIDE FILM AND METALLIZED POLYIMIDE FILM

摘要

PROBLEM TO BE SOLVED: To provide a high reliability circuit board supporting conductor patterns with sufficient adhesive strength by metallized polyimide film excellent in adhesive strength to a metallic layer. SOLUTION: The polyimide film is produced from a polyamic acid obtained by reacting an aromatic diamine with an aromatic tetracarboxylic acid and has a surface of 270-450 N/m Martens' hardness, and the metallized film is obtained by laminating a metallic layer on the polyimide film. COPYRIGHT: (C)2007,JPO&INPIT