| 发明名称 |
Method of processing a substrate |
| 摘要 |
There is disclosed a method of processing a substrate, which comprises applying a surfactant or a water soluble polymer agent onto a surface of a substrate to be processed, and sliding a circumferential portion of the substrate and a polishing member against each other to polish the circumferential portion of the substrate.
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| 申请公布号 |
US2007178701(A1) |
申请公布日期 |
2007.08.02 |
| 申请号 |
US20070730890 |
申请日期 |
2007.04.04 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
TOYOTA GEN;SHIGETA ATSUSHI;YANO HIROYUKI |
| 分类号 |
H01L21/302;B24B9/06;B24B37/02;H01L21/00;H01L21/304;H01L21/306;H01L21/461;H01L21/76 |
主分类号 |
H01L21/302 |
| 代理机构 |
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代理人 |
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| 主权项 |
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