METHOD AND DEVICE FOR THE CORRECTION OF IMAGING DEFECTS

摘要

The invention relates to a projection exposure system that is used in semiconductor lithography and comprises a first and at least one additional optical corrective element. The first optical corrective element is disposed in the area of a pupil level of the projection exposure system while the additional optical corrective element is placed at a greater distance from the pupil level than the first corrective element. The invention further relates to a projection exposure system that is used in semiconductor lithography and comprises a first and at least one additional optical corrective element. The first optical corrective element is arranged in a support mount near a pupil level of the projection exposure system while the additional optical corrective element is removably positioned within the support mount in an auxiliary mount. The invention also relates to a method for correcting imaging defects of a projection exposure system used in semiconductor lithography. Said method encompasses at least the following steps: - an optical corrective element is supplied; - the service parameters of the projection exposure system are detected; - degradation symptoms are predicted; - at least one adapted corrective element is produced ahead of time; - and the corrective element is replaced at a given point in time.