发明名称 |
Method for manufacturing printed circuit board with thin film capacitor embedded therein |
摘要 |
In a method for manufacturing a printed circuit board with a thin film capacitor embedded therein, a conductive metal is sputtered via a first mask to form a lower electrode. A dielectric material is sputtered via a second mask to form a dielectric layer. The conductive metal is sputtered via a third mask to form an upper electrode. An insulating layer is stacked on a stack body with the upper electrode formed therein and via holes are perforated from a top surface of the insulating layer to a top surface of the lower electrode and from the top surface of the insulating layer to a top surface of the upper electrode formed on the substrate. Also, the stack body with the via holes formed therein is electrolytically and electrolessly plated.
|
申请公布号 |
US2007178412(A1) |
申请公布日期 |
2007.08.02 |
申请号 |
US20070700864 |
申请日期 |
2007.02.01 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
JUNG HYUNG MI;CHUNG YUL KYO;KANG HYUNG DONG |
分类号 |
G03C5/00 |
主分类号 |
G03C5/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|