| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of performing a superb bonding between aluminum members 11, or between an aluminum member 11 and a copper member 25, using Sn or Sn alloy, and to provide a bonded body 10. SOLUTION: In the bonding method to bond aluminum members 11 using the solder H, aluminum members 11 are bonded together, employing the solder H composed of Sn or Sn alloy containing 0.005 mass% or more of Al, while applying ultrasonic vibration to the solder H or the aluminum member 11. COPYRIGHT: (C)2007,JPO&INPIT |
