Soldering method, electronic part, and part-exchanging method

摘要

A soldering method for soldering an electronic part on a substrate (10) by reflow soldering is disclosed that includes the steps of applying a solder paste on the substrate (S10); mounting the electronic part on the substrate by using the solder paste (S12); disposing a heat capacity enhancing member on the electronic part (S14), the heat capacity enhancing member including a gel-like material able to enhance the heat capacity of the electronic part; and soldering the electronic part onto the substrate by reflow soldering (S16) with the heat capacity enhancing member being applied thereon.