发明名称 |
Method and apparatus for forming stacked die and substrate structures for increased packing density |
摘要 |
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and overlying the at least one die in a manner such that the first circuitized substrate serves as an electrical interconnection device and a heat spreading lid. The first circuitized substrate is further configured so as to facilitate cooling of the at least one die by at least a cross flow of a cooling medium therethrough.
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申请公布号 |
US7250675(B2) |
申请公布日期 |
2007.07.31 |
申请号 |
US20050908277 |
申请日期 |
2005.05.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FASANO BENJAMIN V.;SUNDLOF BRIAN R. |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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