发明名称 Multilayer chip capacitor and method for manufacturing the same
摘要 A multilayer chip capacitor, and a method for manufacturing the same are provided. The capacitor includes a capacitor body having a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes formed on the dielectric layers, each of the internal electrodes including a main electrode portion and a lead portion, chip-protecting side members formed on both sides of the capacitor body to contact both sides of the first and second internal electrodes, and a pair of external electrodes formed on the outer surface of the capacitor body. The width of the main electrode portion is the same as that of the dielectric layers, and the width of the lead portion is smaller than that of the dielectric layers.
申请公布号 US7251119(B2) 申请公布日期 2007.07.31
申请号 US20050272893 申请日期 2005.11.15
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM HYOUNG HO;SHIN HYO SOON;CHOO HO SUNG
分类号 H01G4/06;H01G4/005 主分类号 H01G4/06
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