| 摘要 |
A METHOD OF FORMING A LEADFRAME (10) A SEMICONDUCTOR PACKAGE (30) USING THE LEADFRAME (10) FACILITATES SELECTIVELY FORMING LEADS FOR THE PACKAGE. THE LEADFRAME (10) IS FORMED WITH A FIRST PORTION OF THE LEADS (17, 18, 19, 20) EXTENDING FROM A PANEL OF THE LEADFRAME (10) INTO A MOLDING CAVITY SECTION (16) OF THE LEADFRAME (10). AFTER ENCAPSULATION, A PORTION OF THE LEADFRAME PANEL (11) IS USED TO FORM A SECOND PORTION OF THE LEADS (17, 18, 19, 20) THAT IS EXTERNAL TO THE PACKAGE BODY (38).(FIG 4,6) |
