发明名称 APPARATUS FOR RAPID METAL COATING AND METHOD THEREOF
摘要 A high speed plating apparatus which can increase the plating efficiency by promptly stirring a plating solution while preventing a plating object from trembling, and a high speed plating method using the high speed plating apparatus are provided. A high speed plating apparatus comprises: an electroplating pot(100) in which a plating solution is contained, on which an inlet and an outlet are formed such that a sheet type plating object(10) continuously passes through the plating solution, and which has an introduction pipe(110) and a discharge pipe(120) for continuously circulating the plating solution; an anode material(200) disposed at a position that is spaced apart from the plating object continuously passing through the electroplating pot in a predetermined distance; supporting members(300) for simultaneously supporting the plating object continuously passing through the electroplating pot to protect the plating object from a fast flow of the plating solution, and performing an endless track rotation by a driving force caused by the movement of the plating object; and deflection preventing rollers(400) installed oppositely to the supporting members in the electroplating pot. The high speed plating apparatus further comprises cutoff rolls(130) installed at the inlet and outlet sides of the electroplating pot to prevent the plating solution from being discharged.
申请公布号 KR20070077901(A) 申请公布日期 2007.07.30
申请号 KR20060007746 申请日期 2006.01.25
申请人 LS CABLE LTD. 发明人 KIM, KYUNG KAK;JUN, SANG HYUN;AN, JOONG KYU;KIM, PAN SEOK
分类号 C25D17/02 主分类号 C25D17/02
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