| 摘要 |
A stacked semiconductor package and a substrate including the same are provided to reduce the size of the stacked semiconductor package by decreasing a space between upper and lower semiconductor packages using a lower lead inserted into a portion between upper leads. A stacked semiconductor package includes a lower semiconductor chip, a lower lead, an upper semiconductor chip, an upper lead and a first connection member. The lower lead(23a) is electrically connected to the lower semiconductor chip. The upper semiconductor chip is stacked on the lower semiconductor chip. The upper lead(27a) is electrically connected to the upper semiconductor chip. The first connection member(33) is used for connecting electrically the upper lead with the lower lead. The lower lead is inserted into a predetermined portion between upper leads.
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