发明名称 Semiconductor device manufacturing method, library used for the same, recording medium, and semiconductor device manufacturing system
摘要 To provide a semiconductor device manufacturing method of making a pattern formation possible with high precision at a high speed, the same block can be completed by one process a cell by dividing the layout data into cells in the OPC processing step and then applying the OPC to each cell, and the OPC is applied only to the cell boundary portions after respective OPC-applied cells are arranged on the chip, so that a dimensional precision in vicinity of the cell boundaries can be ensured. Also, since the patterns on the cell boundary portions are caused to shrink uniformly, the OPC of the cell boundary portions can be simplified and thus the fast process can be applied.
申请公布号 US2007174807(A1) 申请公布日期 2007.07.26
申请号 US20060487970 申请日期 2006.07.18
申请人 KUMASHIRO MASAHIKO;TANIMOTO TADASHI 发明人 KUMASHIRO MASAHIKO;TANIMOTO TADASHI
分类号 G06F17/50;G03F1/36;G03F1/68;H01L21/027 主分类号 G06F17/50
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