| 摘要 |
An optical head device may include a frame type of laser beam emitting element provided with a heat radiating fin on which a laser chip is mounted, a device frame on which the laser beam emitting element, a light receiving element and an optical system are mounted, and a heat radiation member formed of material having a superior heat conduction property. The upper face of the laser beam emitting element is fixed to the device frame, and an under face of the heat radiating fin which corresponds to a portion where the laser chip is mounted is exposed on an outer side to form an exposed part, and the heat radiation member is disposed to extend over the exposed part and the device frame. The device frame may include a first protective cover covering the optical disk side of the optical elements, and a second protective cover which covers the optical disk side of the objective lens drive mechanism and which is separately formed from the first protective cover and made of material having a superior heat conduction property, and a part of the second protective cover is extended to a laser driver IC, which is disposed to be exposed on the optical disk side, to form a heat radiation part where heat generated in the laser driver IC is radiated.
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