发明名称 HOUSING MECHANISM FOR ELECTRONIC DEVICE AND METHOD FOR MAKING THE SAME
摘要 An exemplary housing mechanism ( 100 ) for an electronic device includes a front cover ( 10 ), a back cover ( 20 ), and an elastic sealing element ( 12 ). The front cover has a projecting edge ( 18 ) defined thereon. The back cover has a recessed edge ( 26 ) defined therein. The elastic sealing element has a tip portion ( 122 ) and is formed or sealed together with the front cover. The projecting edge of the front cover and the tip portion of the elastic sealing element are configured to be press fit into the recessed edge of the back cover.
申请公布号 US2007171603(A1) 申请公布日期 2007.07.26
申请号 US20060610086 申请日期 2006.12.13
申请人 SUTECH TRADING LIMITED 发明人 YANG QING;CHEN CHIA-HUA
分类号 H05K5/00 主分类号 H05K5/00
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