| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device adapted for blocking of the device, having excellent productivity, extendibility, maintainability, and adaptability to users, and having good cooperation efficiency with incidental facility. <P>SOLUTION: The device is equipped with: a load/unload block 5 for delivering a cassette 2; conveyance block 6 for moving a wafer 1, polishing block 7 for polishing the wafer 1; cleaning block 8 for cleaning the wafer 1 after polishing; and control block 9 which memorizes relative position of the cassette 2 of the load/unload block 5 and robot 15 of the conveyance block 6 by teaching, further memorizes the number of wafers in the cassette and position information of the cassette 2 on a housing shelf 13 by the measurement of a sensing sensor 12, and instructs a robot 15 to take the semiconductor wafer 1 out of the shelf of the cassette 2 and to return polished, cleaned, and dried semiconductor wafer 1 to the housing shelf 13. <P>COPYRIGHT: (C)2007,JPO&INPIT |
