发明名称 |
THIN-FILM CIRCUIT DEVICE, METHOD FOR MANUFACTURING THIN-FILM CIRCUIT DEVICE, AND ELECTRONIC APPARATUS |
摘要 |
A thin-film circuit device includes a substrate and a thin-film circuit layer, disposed on the substrate, having an element region and a low-strength region. The element region includes thin-film elements. The low-strength region extends between an end portion of the thin-film circuit layer and the element region and has a mechanical strength less than that of the surroundings of the low-strength region.
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申请公布号 |
US2007173031(A1) |
申请公布日期 |
2007.07.26 |
申请号 |
US20070625978 |
申请日期 |
2007.01.23 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KODAIRA TAIMEI;UTSUNOMIYA SUMIO |
分类号 |
H01L21/76 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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