SOLID IMAGING DEVICE AND MANUFACTURING METHOD THEREOF
摘要
It is possible to provide a solid state imaging device and its manufacturing method capable of reducing the device size and improving the productivity. The solid state imaging device has a 3D structure for mounting a solid state imaging element and a translucent member. The 3D structure includes: a solid state imaging element mounting unit formed by an insulating resin and having a through opening for mounting the solid state element on the opening surface to which the light receiving surface of the solid state imaging element faces; and a stepped portion for mounting the translucent member on the brim of the opening surface. The light receiving surface and the translucent member are mounted at a predetermined interval so as to cover the through opening.
申请公布号
WO2007083564(A1)
申请公布日期
2007.07.26
申请号
WO2007JP50246
申请日期
2007.01.11
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;HARAZONO, HUMIKAZU;NAKAGIRI, YASUSHI;SUGAHARA, KEN
发明人
HARAZONO, HUMIKAZU;NAKAGIRI, YASUSHI;SUGAHARA, KEN