发明名称 METHOD AND DEVICE FOR CONNECTING WIRING BOARD, MOUNTING STRUCTURE AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide connection method/device of a wiring board with which the size change is suppressed, there is less misplacements, and connection is realized with high accuracy, and to provide a mounting structure and an electronic apparatus. SOLUTION: The method comprises a tension-adding process for grasping FPC41 and adding tension, in a direction of following the direction crossing an arranging direction of a first terminal electrode 55 with respect to FPC41, an abutting process for making a first terminal 53 abut against a second terminal 67, and a heating pressurizing process for pressurizing the first terminal 53, while it is heated directed toward the second terminal 67 and electrically connecting FPC 41 and a liquid crystal panel 42. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007189046(A) 申请公布日期 2007.07.26
申请号 JP20060005745 申请日期 2006.01.13
申请人 SEIKO EPSON CORP 发明人 SATO HIDEKAZU
分类号 H05K3/36 主分类号 H05K3/36
代理机构 代理人
主权项
地址