| 摘要 |
<P>PROBLEM TO BE SOLVED: To efficiently remove a polishing product and an "old polishing liquid" remaining on a surface (polishing surface) or in through-holes of a polishing pad. <P>SOLUTION: A plurality of through-holes 66b provided inside a polishing pad 66 and extending in the thickness direction communicate with each other by communication grooves 66c. Conditioning of the polishing pad 66 can be performed while efficiently removing a polishing product and an "old polishing liquid" remaining on a surface (polishing surface) 66a, or in the through-holes 66b of the polishing pad 66 by pushing them to flow to the outside through the communication grooves 66c with a liquid which is applied to the polishing pad 66 when conditioning the polishing pad. <P>COPYRIGHT: (C)2007,JPO&INPIT |
